Wolfspeed Inc (NYSE: WOLF) experienced a 3% uptick in premarket trading following the introduction of a new silicon carbide package family aimed specifically at the heat-management challenges of AI datacenters.
The company unveiled its TOLT portfolio - an acronym for TO-Leaded, Top-Side Cooled - which is built on Wolfspeed’s Gen 4 MOSFET technology. The design channels heat away from the package via the top side, a configuration Wolfspeed says improves cooling efficiency and supports the development of smaller, more reliable power systems for AI datacenter environments.
In comments provided by Guy Moxey, vice president of Wolfspeed’s Industrial & Energy business, the company framed the new portfolio as a response to evolving datacenter requirements. "AI is pushing datacenter OEMs to be incredibly strategic about the size and total efficiency of their power systems," Moxey said. "Our TOLT product family offers a straightforward path to delivering higher-density, thermally optimized power systems capable of sustaining the demands of AI datacenters, and Wolfspeed’s Gen 4 technology helps these systems run cooler, more efficiently, and more reliably."
The TOLT product family represents the second of three planned top-side cooled package lines from Wolfspeed, following the earlier release of the U2 portfolio. The company stated that it will provide further information regarding the third top-side cooled family in the second half of 2026.
Wolfspeed also emphasized its U.S.-based silicon carbide wafer manufacturing, noting that domestic production supports supply chain resilience and consistent performance at scale. The company framed this capability as particularly relevant as global markets place greater emphasis on securing supply chains for critical technologies.
The initial TOLT offerings are 650V devices and are listed as available now in multiple RDS(ON) options through Wolfspeed’s website.
Market context and implications
The immediate market reaction - a 3% premarket rise in shares - reflects investor response to Wolfspeed’s product announcement. The new TOLT portfolio targets a specific set of thermal and density problems associated with AI datacenter power infrastructure, positioning the company to supply components that manufacturers can integrate into more compact, thermally optimized systems.
Wolfspeed’s emphasis on U.S.-based wafer fabrication underscores a supply chain message that the company believes will resonate with customers prioritizing domestic production and consistency as they scale deployments of silicon carbide technology.
Availability
Wolfspeed says 650V TOLT products are available now in a range of RDS(ON) options via its website.
Conclusion
The announcement of the TOLT portfolio and the explicit timeline for a third top-side cooled family in the second half of 2026 provide a near-term product roadmap. For market participants focused on semiconductors, datacenter power design, and critical technology supply chains, Wolfspeed’s release adds a new option aimed at improving thermal performance and system density without introducing new claims beyond the company’s statements.