SoftBank Corp's unit Saimemory and Intel Corporation announced a partnership to develop a novel class of memory chip technology they have named Z-Angle operation memory technology.
According to the companies, the collaboration focuses on bringing to market memory devices that seek to combine three attributes: high capacity, high bandwidth and low power consumption. The joint goal is to create chips that meet those technical targets and that can be integrated into environments demanding heavy computational throughput.
The statement from SoftBank notes the technology is being developed with artificial intelligence data centers specifically in mind. High-speed memory is cited as a critical component for AI data centers because running large generative AI models requires substantial memory bandwidth and capacity to sustain compute operations.
Under the terms described, Saimemory will work with Intel's next-generation DRAM bonding initiative as part of the development process. The companies said they aim to produce prototypes by at least early-2028, providing a concrete near-term timeline for initial hardware samples.
SoftBank Corp is identified as a publicly listed unit of SoftBank Group Corp. and serves as the conglomerate's primary operating company. The statement also notes that SoftBank Group had in mid-2025 agreed to make a $2 billion investment in Intel.
Intel framed the collaboration in the context of strengthening its memory and chip portfolio as it looks to expand its presence supplying technology for the AI sector. The development work on Z-Angle operation memory technology and the use of DRAM bonding techniques are positioned as steps to enhance Intel's competitive offering in this market.
Summary
Saimemory, a unit of SoftBank Corp (TYO:9434), has entered a development partnership with Intel Corporation (NASDAQ:INTC) to commercialize Z-Angle operation memory technology. The design goals are higher capacity, greater bandwidth and lower power usage, aimed at AI data center workloads. The project will leverage Intel's DRAM bonding initiative and targets prototype completion by at least early-2028. SoftBank Group (TYO:9984) had previously agreed to invest $2 billion in Intel in mid-2025.
Key points
- Saimemory and Intel will co-develop Z-Angle operation memory technology focused on capacity, bandwidth and energy efficiency.
- The technology is intended for artificial intelligence data centers, where high-speed memory is critical to running large models.
- The partnership will use Intel's next-generation DRAM bonding initiative and aims to yield prototypes by at least early-2028.
Risks and uncertainties
- Timing risk - the target to create prototypes by at least early-2028 represents a development timeline that may be subject to change.
- Execution risk - commercializing a new memory architecture that meets the stated goals for capacity, bandwidth and power presents technical and integration challenges.
- Market competitiveness - Intel's effort to shore up its chip offerings for the AI sector implies competitive pressure from other suppliers, which could affect adoption and market share.