Micron Technology announced a roughly $24 billion investment planned over the coming decade to enlarge its chip manufacturing operations in Singapore, targeting rising demand for memory driven by AI and data-centric applications.
The company said it has started construction on an advanced wafer fabrication plant within its established NAND manufacturing complex in Singapore. Micron expects wafer production from the new facility to begin in the second half of 2028.
Designed as Singapore’s first double-storey wafer fab, the new plant is intended to ultimately deliver about 700,000 square feet of cleanroom space. The configuration aims to expand footprint without the same horizontal land requirements as single-level fabs.
Micron noted the high-bandwidth memory (HBM) advanced packaging facility it previously announced at the same site is progressing on schedule and is expected to supply HBM beginning in 2027. The company said the proximity of the packaging line and the new wafer fab creates potential synergies between NAND and DRAM-related production and packaging activities on the campus.
Employment impacts were highlighted as part of the announcement. Micron said the investment is expected to create about 1,600 new jobs, which would be additive to roughly 1,400 positions from earlier expansion plans at the Singapore site. Singapore officials framed the project as a reinforcement of the country’s semiconductor ecosystem and its positioning within global supply chains.
From an operational standpoint, the timeline laid out in Micron’s statement provides specific near-term milestones: HBM packaging contribution from 2027 and wafer output from the new double-storey fab in the latter half of 2028. The company’s comments emphasize integration across NAND, DRAM and advanced packaging at the Singapore complex.
Impacted sectors - semiconductor manufacturing, semiconductor equipment suppliers, and regional supply chain logistics are directly implicated by the investment and construction activity.
What remains explicit in Micron’s announcement - the investment amount, the construction start on a double-storey wafer fab, projected timelines for HBM contribution and wafer output, the planned cleanroom capacity, and the expected job totals linked to the project.