Press Releases September 29, 2026 11:00 AM

Vishay Intertechnology Releases New Top-Side Cooling Mount Thick Film Power Resistor in Compact TO-263 (D²PAK) Package

Vishay Intertechnology launches innovative Automotive Grade top-side cooling thick film power resistor advancing thermal management in automotive applications.

By Priya Menon
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Vishay Intertechnology unveiled the D2TO35S, a new Automotive Grade thick film power resistor designed with top-side cooling in a compact TO-263 (D²PAK) package. The resistor offers enhanced thermal performance and up to nine times greater power dissipation compared to standard PCB-mounted devices when used with a heatsink, enabling smaller footprint designs and improved system reliability for automotive and other demanding applications.

Vishay Intertechnology Releases New Top-Side Cooling Mount Thick Film Power Resistor in Compact TO-263 (D²PAK) Package
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Key Points

  • Introduction of D2TO35S power resistor with top-side cooling mount improving thermal efficiency in automotive electronics.
  • Device delivers high power dissipation of 35 W at 25°C with a compact surface-mount TO-263 package saving board space.
  • Designed for robust performance with wide resistance range, tight tolerance, wide temperature range, and compliance with RoHS.

MALVERN, Pa., Sept. 29, 2026 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new Automotive Grade top-side cooling mount thick film power resistor. Designed for automotive applications, the Vishay Sfernice D2TO35S improves thermal performance and reduces board space requirements, while delivering high power dissipation of 35 W at 25 °C in the surface-mount TO-263 (D²PAK) package.

As thermal constraints increasingly become the primary system design limitation, many power components are transitioning from PCB-based cooling to top-side cooled architectures. By transferring heat directly to a heatsink, the D2TO35S released today enables up to nine times greater power dissipation than standard PCB-mounted devices when paired with an appropriate heatsink. Its compact, surface-mount design allows designers to increase power dissipation within the same footprint or provide the same functionality in a smaller footprint, while lowering PCB temperatures, reducing thermal stress on neighboring components, and improving overall system reliability.

Offering a non-inductive design for improved signal integrity and power handling in fast transient conditions, the D2TO35S features a resistance range from 4.7 Ω to 550 kΩ — with tolerances down to ± 1 % — thermal resistance of 4.28 °C/W, TCR down to ± 150 ppm/°C, and a wide operating temperature range from -55 °C to +175 °C. The RoHS-compliant device is solder reflow secure at 270 °C/10 s.

Samples and production quantities of the D2TO35S are available now with lead times of fourteen weeks.

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.® Vishay Intertechnology, Inc. is a Fortune 1000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.

The DNA of tech® is a registered trademark of Vishay Intertechnology, Inc.

Vishay on Facebook: http://www.facebook.com/VishayIntertechnology
Vishay Twitter feed: http://twitter.com/vishayindust

Links to product datasheets:
http://www.vishay.com/ppg?51112  (D2TO35S)

Link to product photo:
https://www.flickr.com/photos/vishay/albums/72177720335659880

For more information please contact:
Vishay Intertechnology
Peter Henrici, +1 408 567-8400
peter.henrici@vishay.com
 or
Redpines
Bob Decker, +1 415 409-0233
bob.decker@redpinesgroup.com


Risks

  • Lead times of fourteen weeks may impact customer supply chains and product rollout schedules.
  • Adoption depends on designers' willingness to transition to top-side cooled architectures which may require design changes.
  • Thermal management benefits depend on pairing with appropriate heatsinks, adding to system complexity and cost.

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